The Odyssey is the only event in 2011 targeted specifically to diecutting, diemaking, foil stamping, embossing and bindery. As an attendee of Odyssey, you will experience a unique, world-class amalgam of education and technology.

Presented by the International Association of Diecutting and Diemaking and the Foil Stamping and Embossing Association, the Odyssey focuses on innovative processes, next generation materials, and unique industry services. Odyssey provides the perfect opportunity to connect with your fellow converters, industry and association leaders, and suppliers.

The Odyssey Technology Hall is where you will find the widest range of products and services specific to diecutting, diemaking, foil stamping and embossing processes. Looking for something specific? With an expected 150+ exhibitors, you are sure to find it in the Technology Hall:
Automated rule processing & bending equipment
Blanking systems & accessories
CAD/CAM software systems
Consultants
Counter cutter equipment & materials
Counterplates
Creasing matrix
Cutting surfaces
Cutting blankets/jackets
Die ejection materials
Die storage racks
Dieboards
Diecutting automation systems
Diecutting and diemaking
Diemakers
Digital diecutting systems
Embossing equipment & supplies
Engravers - magnesium, copper, and brass
Estimating software
Financing
Foil stamping equipment & supplies
Gripper bars
Hologram registration systems
Hologram suppliers
Hot stamping foils
Inspection systems
Jig saws
Laser cutting systems
Makeready systems
Plotters
Presses
Proofers
Rule processing equipment
Samplemakers
Steel rule
Unwind/rewind systems
Used equipment
Waterjet cutting & equipment
Mark your calendar now for May 4-6, 2011.

This website will be frequently updated as more information becomes available.